Dow’s Newly Launched Automotive Adhesive Accelerates Assembly and Lowers Production Costs
Dow Performance Silicones has introduced a new high-performance material to its growing portfolio of advanced assembly solutions for the automotive industry. Offered under the new DOWSIL™ brand (formerly Dow Corning®) EA-6060 Adhesive develops strong adhesion to metal and plastic substrates in under an hour at temperatures below 100°C.
DOWSIL Silicone Adhesive
Significant Process Optimization Opportunities
This offers manufacturers of automotive control units, sensors and modules significant process optimization opportunities compared to many commonly used adhesives.
Rogier Reinders, global marketing director for Dow:
“Many automotive suppliers are under pressure to speed assembly and lower production costs without compromising the performance of control units and sensor modules. New DOWSIL™ EA-6060 Adhesive helps to address all of these challenges by forming fast, reliable bonds on common metal and plastic substrates at lower temperatures than currently available products.”
Key Features and Benefits
Two-Part, Low Temperature Cure: Enables assembly production savings due to a fast cure at a moderate temperature (80°C).
Better Transmission: Retains original physical and electrical properties over a broad range of operating conditions, with a scavenger to reduce voids.
Longer Open Time: More efficient processability; greater manufacturing flexibility and reduced waste.
UV Dyed: Enables easier inspections.
Available as a two-part formulation, DOWSIL™ EA-6060 Adhesive develops required adhesion within 30 minutes at 80°C (176°F), though the material also allows accelerated cure at higher temperatures. After cure, it delivers reliable adhesion for common substrates, such as the metal housings and plastic lids used in automotive module assembly.
DOWSIL™ EA-6060 Adhesive supports precision metering and dispensing equipment while remaining free of bubbles and voids, even if assembly does not occur directly after the adhesive is dispensed.
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